Injection molded image sensor and a method for manufacturing the same

A method for manufacturing an injection molded image sensor, comprising the steps of:

• providing a plurality of metal sheets arranged in a matrix, each of the metal sheets having a first board, a second board and a third board to form a -shaped structure;
• performing a first injection molding process to seal the metal sheets and form a first molded body, wherein the first boards are exposed from a top surface of the first molded body to form signal input terminals, the second boards are exposed from a bottom surface of the first molded body to form signal output terminals, and the third boards are exposed from a side surface of the first molded body;
• providing a connection board;
• placing four first molded bodies around the connection board to form a U-shaped structure;
• performing a second injection molding process to mold the first molded bodies and the connection board into a second molded body so that the second molded body is combined with the first molded bodies and is formed with a cavity;
• placing a photosensitive chip, on which a plurality of bonding pads is formed, within the cavity;
• providing a plurality of wires for electrically connecting the bonding pads to the signal input terminals;
• and
• placing a transparent layer over the first molded bodies to encapsulate the photosensitive chip.