Negative volume expansion lead-free electrical connection
AssigneeInternational Business Machines Corporation
InventorsDavid V. Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel
Life of this patent
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Abstract
An electronic package is provided including a substrate, a device mounted on the substrate, and a solder member electrically coupling the device to the substrate. The package includes a dielectric material positioned substantially around the solder member which forms a physical connection between the substrate and the device. The volume of the solder member contracts during melting thereof to prevent failure of the physical connection and/or the electrical coupling between the substrate and the device.
Claims20
An electrical connection comprising:
- a first conductor;
- a second conductor;
- and
- a volume of solder used to form said electrical connection between said first conductor, said solder being comprised of a metal selected from the group consisting of tin, bismuth, antimony, gallium, and alloys thereof;
- and said second conductor wherein said volume of solder is contractible during melting thereof at a volume contraction of less than about 3%.
An electrical package consisting:
- a substrate;
- a device mounted on said substrate;
- at least one solder member electrically coupling said device to said substrate;
- and
- a dielectric material positioned substantially around said at least one solder member wherein said at least one solder member is comprised of a metal selected from the group consisting of tin, bismuth, antimony, gallium, and alloys thereof, and forming a physical connection between said substrate and said device, the volume of said at least one solder member contracting during melting of said solder by a volume contraction of less than about 3%.
An electronic package comprising:
- a substrate;
- a device mounted on said substrate;
- at least one solder member electrically coupling said device to said substrate, said at least one solder member being comprised of a metal selected from the group consisting of tin, bismuth, antimony, gallium, and alloys thereof;
- and
- a dielectric material positioned substantially around said at least one solder member and forming a physical connection between said substrate and said device, the volume of said at least one solder member contracting during melting thereof with a volume contraction of less than about 3% to prevent failure of said physical connection and/or said electrical coupling between said substrate and said device.
Dependencies are inferred from the claim text.