Apparatus and method for coupling with components in a surface mount package

A surface mount package for an electronic device, said surface mount package comprising:

• a substrate having a pattern of conductive traces thereon, said conductive traces electrically coupled to an upper pattern and a lower pattern of conductive bonding pads, said lower pattern of bonding pads electrically connected to an array of conductive appurtenances;
• a semiconductor die electrically coupled to said upper pattern of bonding pads, said semiconductor die deploying said electronic device;
• and
• a cover disposed upon said die and said substrate, said cover including an access portal to said semiconductor die, wherein said access portal effectuates direct access selectively to said semiconductor die and to said upper pattern of said bonding pads.

A method for forming a surface mount package for an electronic device, said method comprising:

• forming an interconnect structure on a substrate;
• forming a first pattern of bonding pads over the top of said substrate, said first pattern of bonding pads electrically coupled to said interconnect structure;
• disposing a semiconductor die over said substrate, said semiconductor die deploying an electronic device, said electronic device electrically coupled to said first pattern of bonding pads;
• forming a second pattern of bonding pads on the bottom of said substrate, said second pattern of bonding pads electrically coupled to said interconnect structure;
• arraying a plurality of conductive appurtenances beneath the bottom of said substrate, said plurality of conductive appurtenances electrically coupled to said second pattern of bonding pads;
• disposing a cover upon said die and said substrate;
• and
• forming an access portal in said cover, wherein said portal effectuates selectively accessing said die and said first pattern of bonding pads via said access portal.