Method of manufacturing a semiconductor device having flexible wiring substrate
AssigneesHitachi, Ltd., Hitachi Hokkai Semiconductor, Ltd.
InventorSeiichi Tomihara
Life of this patent
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Abstract
Peeling between a molding resin and a substrate is prevented to improve the quality of a semiconductor device. A film substrate capable of being deformed following shrinkage upon curing of a molding resin and having plural partitioned device areas is provided. Then, a block molding is performed so as to cover the plural device areas in a lump on a chip bearing surface side of the film substrate. Thereafter the film substrate is subjected to dicing wherein a cutting blade is advanced toward a block molding portion to divide the film substrate device area by device area in accordance with a down cutting method, whereby peeling of the substrate in the dicing work can be prevented.
Claims5
A method of manufacturing a semiconductor device, comprising the steps of:
- providing a flexible Wiring substrate having a front surface, a back surface opposite from the front surface, a plurality of device areas of the front surface thereof and a plurality of electrodes formed on each device area;
- providing semiconductor chips each having a main surface, a back surface opposed of the main surface thereof and a plurality of electrodes formed on the main surface;
- mounting the semiconductor chips respectively on the device areas of the front surface of the flexible wiring substrate;
- connecting electrodes of the semiconductor chips with the electrodes of the flexible wiring substrate on respective device areas of the front surface of the flexible wiring substrate by means of conductive members;
- sealing the semiconductor chips and the plural device areas of the front surface of the flexible wiring substrate by a resin body formed according to a block molding method;
- cutting the flexible wiring substrate and the resin body to divide them between respective device areas of the front surface of the flexible wiring substrate using a cutting blade,
- wherein, in the cutting step, a rotation axis of the cutting blade is positioned over the back surface of the flexible wiring substrate, and moving the cutting blade while feeding the wiring substrate and the resin body in a same direction as rotation of the cutting blade.
Dependencies are inferred from the claim text.