Hermetic package for multiple contact-sensitive electronic devices and methods of manufacturing thereof

A method of mnanufacturing a hermetic package, comprising:

• forming a plurality of contact-sensitive electronic devices on a device substrate, each of said plurality of devices having an active surface;
• providing a mounting substrate;
• forming a grid of dam material between said device substrate and said mounting substrate that is pitched as a function of lateral dimensions of said plurality of devices;
• bringing said device substrate and said mounting substrate together until said active surface of each of said plurality of devices is proximate, but spaced apart from, said mounting substrate, said mounting substrate and said dam material cooperating to form packages for said plurality of devices, wherein said bringing and said forming a grid of dam material are carried out in a single step;
• and
• dicing said device substrate to separate said packages.