System for facilitating alignment of silicon die
AssigneeSun Microsystems, Inc.
InventorVadim Gektin
Life of this patent
Estimating the term…
Abstract
In accordance with the present invention, a method is described which facilitates heat transfer from a silicon die after the silicon die is bonded to a substrate. An alignment tool is used to align the spacer with the silicon die. A thermal conductor can be placed on the silicon layer after the silicon layer has been bonded to the substrate layer. A die interface material is not necessarily applied between the silicon die and the thermal conductor. A spacer is used between the substrate and the thermal conductor. The spacer can facilitate heat transfer from the die. The spacer can facilitate force transfer from the thermal lid to the die. The spacer allows a thermal conductor to be affixed to the silicon die without use of a die interface. An alignment tool is used to align the spacer with the silicon die.
Claims18
A method of facilitating alignment of a silicon die during manufacture of an integrated circuit package, comprising:
- bonding a silicon die to a substrate;
- disposing a spacer on the substrate;
- and,
- using an alignment tool to align the spacer with the silicon die, the alignment tool including a reference element to align the spacer with the silicon die such that the silicon die and the spacer are aligned at a predetermined height variance;
- and
- placing a thermal conductor on the silicon die without using a die interface.
A method of facilitating alignment of a silicon die during manufacture of an integrated circuit package, comprising:
- bonding a silicon die to a substrate;
- disposing on the substrate a means for maintaining a spacing between a thermal conductor and the substrate;
- using an alignment tool to align the means for maintaining the spacing and the silicon die, the means for maintaining a spacing between the thermal conductor and the substrate including a reference element to align the spacer with the silicon die such that the silicon die and the spacer are aligned at a predetermined height variance;
- and
- placing the thermal conductor on the silicon die without using a die interface.
A method of facilitating alignment of a silicon die during manufacture of an integrated circuit package, comprising:
- bonding a silicon die to a substrate;
- disposing on the substrate a means for transferring force from a thermal conductor to the substrate;
- using an alignment tool to align the means for transferring force with the silicon die, the alignment tool including a reference element to enable aligning the spacer with the silicon die such that the silicon die and the spacer are aligned at a predetermined height variance;
- and
- placing a thermal conductor on the silicon die without using a die interface.
An apparatus to facilitate alignment of a silicon die during manufacture of an integrated circuit package, comprising:
- a silicon die bonded to a substrate;
- a spacer, wherein the spacer is operably disposed on the substrate;
- an alignment tool, the alignment tool including a reference element to align the spacer with silicon die such that the silicon die and the spacer are aligned at a predetermined height variance, the alignment tool enabling the placing of a thermal conductor on the silicon die without using a die interface.
Dependencies are inferred from the claim text.