Self-healing flexible photonic composites for light sources

A process for manufacturing an organic light-emitting diode, comprising the following steps:

• (a) mixing a first photonic material with a curable, first monomer composition in the absence of solvent to produce a first blend;
• (b) evaporating the first blend in a vapor deposition unit to produce a first vapor;
• (c) condensing the first vapor as a first film onto a first electrode layer;
• (d) curing the first film to produce a first solid photonic layer;
• (e) mixing a second photonic material with a curable, second monomer composition in the absence of solvent to produce a second blend;
• (f) evaporating the second blend in a vapor deposition unit to produce a second vapor;
• (g) condensing the second vapor as a second film onto said first solid photonic layer;
• (h) curing the second film to produce a second solid photonic layer;
• and
• (i) placing a second electrode layer over said second solid photonic layer;
• wherein one of said first and second electrode layers has a surface resistance of at least 2 ohm/sq;
• and
• wherein said steps (b) through (d) and (f) through (i) are carried out in a single vapor deposition unit.

A process for manufacturing an organic light-emitting diode, comprising the following steps:

• (a) mixing an electron-donor material with a curable, first monomer composition in the absence of solvent to produce a first blend;
• (b) evaporating the first blend in a vapor deposition unit to produce a first vapor;
• (c) condensing the first vapor as a first film onto an anode layer;
• (d) curing the first film to produce a solid electron-donor layer;
• (e) mixing an electron-acceptor material with a curable, second monomer composition in the absence of solvent to produce a second blend;
• (f) evaporating the second blend in a vapor deposition unit to produce a second vapor;
• (g) condensing the second vapor as a second film onto a cathode layer;
• (h) curing the second film to produce a solid electron-acceptor layer;
• and
• (i) joining said electron-donor and said electron-acceptor layers to form an organic light-emitting diode;
• wherein said cathode layer has a surface resistance of at least 2 ohm/sq;
• and
• wherein said condensing steps are conducted over a continuous substrate.

A process for manufacturing an organic light-emitting diode, comprising the following steps:

• (a) mixing a photonic material with a curable monomer composition in the absence of a solvent to produce a blend;
• (b) evaporating the blend in a vapor deposition unit to produce a vapor;
• (c) condensing the vapor onto a first electrode layer;
• (d) curing the monomer composition in the blend to produce a solid photonic layer;
• and
• (e) placing a second electrode layer over said solid photonic layer;
• wherein one of said first and second electrode layers has a surface resistance of at least 2 ohm/sq;
• and
• wherein said steps (b) through (e) are carried out in a single vapor deposition unit.

A process for manufacturing an organic light-emitting diode, comprising the following steps:

• (a) mixing a first photonic material with a curable, first monomer composition in the absence of solvent to produce a first blend;
• (b) evaporating the first blend in a vapor deposition unit to produce a first vapor;
• (c) condensing the first vapor as a first film onto a first electrode layer;
• (d) curing the first film to produce a first solid photonic layer;
• (e) mixing a second photonic material with a curable, second monomer composition in the absence of solvent to produce a second blend;
• (f) evaporating the second blend in a vapor deposition unit to produce a second vapor;
• (g) condensing the second vapor as a second film onto said first solid photonic layer;
• (h) curing the second film to produce a second solid photonic layer;
• and
• (i) placing a second electrode layer over said second solid photonic layer;
• wherein one of said first and second electrode layers has a surface resistance of at least 2 ohm/sq;
• and
• wherein said condensing steps are conducted over a continuous substrate.

A process for manufacturing an organic light-emitting diode, comprising the following steps:

• (a) mixing an electron-donor material with a curable, first monomer composition in the absence of solvent to produce a first blend;
• (b) evaporating the first blend in a vapor deposition unit to produce a first vapor;
• (c) condensing the first vapor as a first film onto an anode layer;
• (d) curing the first film to produce a solid electron-donor layer;
• (e) mixing an electron-acceptor material with a curable, second monomer composition in the absence of solvent to produce a second blend;
• (f) evaporating the second blend in a vapor deposition unit to produce a second vapor;
• (g) condensing the second vapor as a second film onto a cathode layer;
• (h) curing the second film to produce a solid electron-acceptor layer;
• and
• (i) joining said electron-donor and said electron-acceptor layers to form an organic light-emitting diode;
• wherein said cathode layer has a surface resistance of at least 2 ohm/sq;
• and
• wherein said steps (b) through (d) and (f) through (h) are carried out in a single chamber.

A process for manufacturing an organic light-emitting diode, comprising the following steps:

• (a) mixing a photonic material with a curable monomer composition in the absence of a solvent to produce a blend;
• (b) flash evaporating the blend in a vapor deposition unit to produce a vapor;
• (c) condensing the vapor onto a first electrode layer;
• (d) curing the monomer composition in the blend to produce a solid photonic layer;
• and
• (e) placing a second electrode layer over said solid photonic layer;
• wherein one of said first and second electrode layers has a surface resistance of at least 2 ohm/sq, as required to cause said one of said first and second electrode layers to melt and become oxidized by reacting with said solid photonic layer when subjected to a current produced by an electrical short.

A process for manufacturing an organic light-emitting diode, comprising the following steps:

• (a) mixing a first photonic material with a curable, first monomer composition in the absence of solvent to produce a first blend;
• (b) flash evaporating the first blend in a vapor deposition unit to produce a first vapor;
• (c) condensing the first vapor as a first film onto a first electrode layer;
• (d) curing the first film to produce a first solid photonic layer;
• (e) mixing a second photonic material with a curable, second monomer composition in the absence of solvent to produce a second blend;
• (f) flash evaporating the second blend in a vapor deposition unit to produce a second vapor;
• (g) condensing the second vapor as a second film onto said first solid photonic layer;
• (h) curing the second film to produce a second solid photonic layer;
• and
• (i) placing a second electrode layer over said second solid photonic layer;
• wherein one of said first and second electrode layers has a surface resistance of at least 2 ohm/sq, as required to cause said one of said first and second electrode layers to melt and become oxidized by reacting with a corresponding solid photonic layer when subjected to a current produced by an electrical short.

A process for manufacturing an organic light-emitting diode, comprising the following steps:

• (a) mixing an electron-donor material with a curable, first monomer composition in the absence of solvent to produce a first blend;
• (b) flash evaporating the first blend in a vapor deposition unit to produce a first vapor;
• (c) condensing the first vapor as a first film onto an anode layer;
• (d) curing the first film to produce a solid electron-donor layer;
• (e) mixing an electron-acceptor material with a curable, second monomer composition in the absence of solvent to produce a second blend;
• (f) flash evaporating the second blend in a vapor deposition unit to produce a second vapor;
• (g) condensing the second vapor as a second film onto a cathode layer;
• (h) curing the second film to produce a solid electron-acceptor layer;
• and
• (i) joining said electron-donor and said electron-acceptor layers to form an organic light-emitting diode;
• wherein said cathode layer has a surface resistance of at least 2 ohm/sq, as required to cause said cathode layer to melt and become oxidized by reacting with said solid electron-acceptor layer when subjected to a current produced by an electrical short.