Integrated circuit having a micromagnetic device and method of manufacture therefor

A method of manufacturing an integrated circuit, comprising:

• locating a capacitor over a substrate, including:
• locating a first capacitive plate layer over said substrate,
• locating a dielectric layer over said first capacitive plate layer, and
• locating a second capacitive plate layer over said dielectric layer;
• and
• forming a micromagnetic device electrically coupled to said capacitor, including:
• locating a first conductive winding layer over said substrate proximate said capacitor,
• locating a first insulative layer over said first conductive winding layer,
• locating a metallic adhesive over said first insulative layer by forming a first layer comprising a first metal and forming a second layer comprising a second metal, and
• locating a ferromagnetic core over said metallic adhesive, said adhesive forming a bond between said first insulative layer and said ferromagnetic core to secure said ferromagnetic core to said substrate.