Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparation

The method of preparing a thermally conductive circuit mounting pad for use in combination with heat generating semi-conductor devices which includes the steps of:

• (a) preparing a dispersion of thermoplastic polymer resin having a glass transition temperature greater than 170° C. and selected from the group consisting of polysulfone (PS), poly-ethersulfone (PES), poly-phenylsulfone (PPSU), and poly-etherimides (PI);
• (b) providing first and second metallic members, said first metallic member having a first side and a generally opposing second side, and said second metallic member having a first side and a generally opposing second side;
• (c) applying a coating of said dispersion onto said first side of said first metallic member and said second side of said second metallic member;
• (d) drying said dispersion coatings to create adherent thermoplastic films on the respective sides of said first and second metallic members;
• (e) positioning said first and second metallic members such that said first side of said first metallic member is in facing relationship with said second side of said second metallic member such that the respective thermoplastic films are in face-to-face contact with one another to form a multiple metallic layer pad;
• and
• (f) subjecting said multiple metallic layer pad to a temperature above about 250° C., and an external pressure of between about 100 psi and 800 psi for a period of greater than 30 minutes to thereby cause said thermoplastic films to commingle and merge into a single uniform thermoplastic film that bondedly secures said two metallic members to one another.