Back to results
US 6,649,076 B2Granted
Method for performing plasma process on particles
AssigneeSony Corporation
InventorNaoki Tamitani
Life of this patent
Estimating the term…
Abstract
The disclosed is a method and apparatus capable of certainly performing a plasma process such as isotropic plasma etching on the whole surface of a particle. A particle (2) is passed through a passage (3) in which inductive coupled plasma is generated and a plasma process is performed on the particle (2). In such a manner, the plasma process on the particle (2) can be performed on the whole surface of the particle (2) in a non-contact manner.
Claims10
A method of performing a plasma process in a conductive cylindrical body including an inner insulating cylindrical body having a passage, the method comprising:
- generating a vacuum in said conductive cylindrical body;
- providing a reaction gas to the passage of said inner insulating cylindrical body;
- delivering high frequency current to a coil wound around a portion of said inner insulating cylindrical body, wherein plasma is generated from the reaction gas;
- and
- supplying a plurality of particles to the passage of said inner insulating cylindrical body in a sequential manner, wherein each of said plurality of particles passes through said plasma.
2 more elements
Dependencies are inferred from the claim text.