Back to results
US 6,649,038 B2Granted
Electroplating method
AssigneeShipley Company, L.L.C.
InventorsRobert D. Mikkola, Jeffrey M. Calvert, Denis Morrissey
Life of this patent
Estimating the term…
Abstract
Disclosed is a method of electroplating substrate such that small recessed features are completely filled with minimum thickness of the deposited metal over fields.
Claims20
A method for depositing copper on a substrate comprising the steps of:
- a) providing the substrate having apertures, the substrate rotating at a speed of about 0 to 10 rpm;
- b) electroplating copper on the rotating substrate with an electroplating solution comprising a soluble copper salt and an electrolyte for a period of time sufficient to deposit the copper into the apertures, the electroplating solution having a flow rate of about 0 to 1 gpm;
- c) then increasing the rotation of the rotating substrate to about 20 rpm or greater and increasing the flow rate of the electroplating solution to about 2 gpm or greater;
- and d) electroplating copper on the rotating substrate with the electroplating solution for a period of time sufficient to deposit a desired thickness of the copper.
1 more element
A method for manufacturing an electronic device comprising the steps of:
- a) providing a substrate having apertures, the substrate rotating at a speed of about 0 to 10 rpm;
- b) electroplating copper on the rotating substrate with an electroplating solution comprising a soluble copper salt and an electrolyte for a period of time sufficient to deposit the copper into the apertures, the electroplating solution having a flow rate of about 0 to 1 gpm;
- c) then increasing the rotation of the rotating substrate to about 20 rpm or greater and increasing the flow rate of the electroplating solution to about 2 gpm or greater and d) electroplating copper on the rotating substrate with the electroplating solution for a period of time sufficient to deposit a desired thickness of the copper.
Dependencies are inferred from the claim text.