Method of mass producing and packaging integrated subsystems
AssigneeDigital Optics Corporation
InventorsMichael R. Feldman, Alan D. Kathman
Life of this patent
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Abstract
Mass production of integrated subsystems may be realized by aligning first and second plurality of dies. The aligned dies are then treated to secure them together. The secured dies are then separated to form a secured pair of dies containing at least one lithographically formed element, thus forming an integrated subsystem. A bonding material may be provided over at least part of each first die, over an entire surface of the wafer or around the perimeter of each first die. Either one of the first or second dies may be provided on a wafer. Either die may contain active elements, e.g., a laser or a detector. The lithographic elements may be formed in the die or may be of a different material than that of the die.
Claims20
A method for forming an integrated subsystem comprising:
- aligning a plurality of second dies with a plurality of first dies, each first die having a second die aligned therewith, at least one of said plurality of first dies and said plurality of said second dies include a corresponding number of lithographically formed elements;
- securing aligned dies;
- and
- dividing secured aligned dies into a plurality of portions, a portion containing a first die, a second die and a lithographically formed element, thereby forming an integrated subsystem, wherein said securing forms a seal around the lithographically formed element.
Dependencies are inferred from the claim text.