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AssigneeMitsubishi Rayon Co., Ltd.
InventorsSatoshi Takeda, Osami Kato, Kenji Watari, Kenji Niikawa, Masamoto Uenishi, Hiroshi Tasaka
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A hollow fiber membrane module and potting material can be used for chemical deaeration in a semiconductor production process, in printers, in a liquid crystal sealing process or in a chemical production process. A hollow fiber membrane module 1 includes, as potting material 2, an epoxy resin cured product in which the weight change per unit surface area of a potting material test piece after immersing the test piece in a chemical for 6 months at room temperature is within the range of −20 to +20 mg/cm2, and as housing 4, a polyolefin in which the weight change per unit surface area of a test piece after immersing the test piece in a chemical for 6 months at room temperature is within the range of −20 to +20 mg/cm2, and the total metal content is 300 ppm or less. The module has a long service life when used for chemical treatment without leakage.
A potting material for a hollow fiber membrane module that adheres and fixes a hollow fiber membrane that is an epoxy resin cured product in which the weight change per unit surface area of a potting material test piece after immersing said test piece in a chemical for 6 months at room temperature is within the range −20 to +20 mg/cm2, and the metal content in the potting material is 50 ppm or less.
A hollow fiber membrane module in which the hollow fiber membrane is housed in a housing material wherein the housing material is a polyolefin in which the weight change per unit surface area of a polyolefin test piece after immersing said test piece in a chemical for 6 months at room temperature is within the range of −20 to +20 mg/cm2, and the total metal content in the polyolefin is 50 ppm or less.
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