Overlap vacuum formed plastic capacitor case
AssigneePacesetter, Inc.
InventorsGregory Scott Fandrich, Thomas Flavian Strange, Thomas V. Graham
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Abstract
The present invention is directed to a method of encasing electrolytic capacitor stacks or wound rolls to form an external package. First, a plastic sheet is heated to its soft transition temperature. Next, the plastic sheet is draped over a preassembled capacitor stack or wound roll. Then, a vacuum is applied to the capacitor stack or wound roll, such that the sheet is formed around the stack or wound roll. Finally, the plastic sheet is allowed to cool. This process results in a vacuum formed plastic capacitor case assembly which minimizes wasted volume in the capacitor package and minimizes capacitor assembly time.
Claims12
A method of encasing an electrolytic capacitor, comprising the following steps:
- (a) heating a plastic sheet;
- (b) placing said heated plastic sheet over said electrolytic capacitor;
- and
- (c) applying a vacuum to said plastic sheet and said electrolytic capacitor, such that said plastic sheet is formed around said electrolytic capacitor.
A method of encasing an electrolytic capacitor, comprising the following steps:
- (a) heating a plastic sheet;
- (b) placing said heated plastic sheet over said electrolytic capacitor and a plastic header connected to said electrolytic capacitor;
- (c) applying a vacuum to said plastic sheet and said electrolytic capacitor, such that said plastic sheet is formed around said electrolytic capacitor and bonded to said plastic header.
Dependencies are inferred from the claim text.