Chemical mechanical polishing pad

A polishing pad for use in chemical mechanical polishing of a substrate, the polishing pad comprising a substantially flat disk having a polishing surface for contacting the substrate, the polishing surface having a central region and a peripheral region, the polishing surface segmented by a first set of substantially parallel linear grooves directed in a first direction and a second set of substantially parallel linear grooves directed in a second direction that is different from the first direction,

• the first set of substantially parallel linear grooves comprising:
• first central grooves having first central groove dimensions including a first central groove width and pitch, the first central grooves traversing the central region of the polishing surface, and
• first peripheral grooves having first peripheral groove dimensions including a first peripheral groove width and pitch, the first peripheral grooves traversing the peripheral region of the polishing surface,
• where at least one of the first central groove dimensions is different from a corresponding first peripheral groove dimension,
• the second set of substantially parallel linear grooves comprising:
• second central grooves having second central groove dimensions including a second central groove width and pitch, the second central grooves traversing the central region of the polishing surface, and
• second peripheral grooves having second peripheral groove dimensions including a second peripheral groove width and pitch, the second peripheral grooves traversing the peripheral region of the polishing surface,
• where at least one of the second central groove dimensions is different from a corresponding second peripheral groove dimension,
• an intermediate region disposed between the central region and the peripheral region, wherein:
• the first set of substantially parallel linear grooves further comprise first intermediate grooves having first intermediate groove dimensions including a first intermediate groove width and pitch, the first intermediate grooves disposed between the first central grooves and the first peripheral grooves, and traversing the intermediate region of the polishing surface, where at least one of the first intermediate groove dimensions is different from a corresponding first central groove dimension and corresponding first peripheral groove dimension, and
• the second set of substantially parallel linear grooves further comprise second intermediate grooves having second intermediate groove dimensions including a second intermediate groove width and pitch, the second intermediate grooves disposed between the second central grooves and the second peripheral grooves, and traversing the intermediate region of the polishing surface, where at least one of the second intermediate groove dimensions is different from a corresponding second central groove dimension and corresponding second peripheral groove dimension.

A polishing pad for use in chemical mechanical polishing of a substrate, the polishing pad comprising a substantially flat disk having a polishing surface for contacting the substrate, the polishing surface having a central region and a peripheral region, the polishing surface segmented by a set of substantially parallel linear grooves, the grooves comprising:

• central grooves having central groove dimensions including a central groove width and pitch, the central grooves traversing the central region of the polishing surface, and
• peripheral grooves having peripheral groove dimensions including a peripheral groove width and pitch, the peripheral grooves traversing the peripheral region of the polishing surface,
• where at least one of the central groove dimensions is different from a corresponding peripheral groove dimensions,
• where each of the grooves completely crosses the polishing pad and has a uniform width.

A polishing pad for use in chemical mechanical polishing of a substrate, the polishing pad comprising a substantially flat disk having a polishing surface for contacting the substrate, the polishing surface having a central region and a peripheral region, the polishing surface segmented by a set of substantially parallel linear grooves, the grooves comprising:

• central grooves having central groove dimensions including a central groove width and pitch, the central grooves traversing the central region of the polishing surface,
• peripheral grooves having peripheral groove dimensions including a peripheral groove width and pitch, the peripheral grooves traversing the peripheral region of the polishing surface,
• where at least one of the central groove dimensions is different from a corresponding peripheral groove dimension, and
• an intermediate region disposed between the central region and the peripheral region, and wherein the set of substantially parallel linear grooves further comprise intermediate grooves having intermediate groove dimensions including an intermediate groove width and pitch, the intermediate grooves disposed between the central grooves and the peripheral grooves, and traversing the intermediate region of the polishing surface, where at least one of the intermediate groove dimensions is different from a corresponding central groove dimension and a corresponding peripheral groove dimension.