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US 6,648,733 B2Granted
Polishing pads and methods relating thereto
AssigneeRodel Holdings, Inc.
InventorsJohn V. H. Roberts, David B. James, Lee Melbourne Cook, Ronald D. Bakule
Life of this patent
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Abstract
A polishing pad with a polishing layer having a macro-texture and a micro-texture wherein the polishing layer is formed by solidifying a flowable material, the polishing layer further comprising hard domains and soft domains, each domain having an average size less than 100 microns.
Claims24
A polishing pad comprising:
- a polishing layer with a polishing surface;
- said polishing layer comprising a material having a plurality of hard domains and soft domains wherein said hard domains have an average size less than 100 microns and said soft domains have an average size less than 100 microns;
- and
- wherein the polishing surface further has a macro-texture produced by solidifying a flowable material.
1 more element
A method for planarizing a silicon, silicon dioxide or metal substrate, comprising:
- i) providing a polishing pad comprising a polishing layer with a polishing surface;
- ii) using a pressure greater than 0.1 kilograms per square meter between the substrate and said polishing surface of said polishing pad;
- wherein the polishing pad has a polishing layer with a polishing surface;
- said polishing layer comprising a material having a plurality of hard domains and soft domains wherein said hard domains have an average size less than 100 microns and said soft domains have an average size less than 100 microns;
- and wherein the polishing surface further has a macro-texture produced by solidifying a flowable material.
2 more elements
Dependencies are inferred from the claim text.