Locking assembly for securing semiconductor device to carrier substrate

An assembly of components for use in a computer comprising:

• a central processing unit;
• an input device;
• an output device;
• a circuit board having a surface and a substantially vertically oriented semiconductor package having a connection edge for surface mounting on said surface of said circuit board comprising:
• a circuit board having at least two J-shaped locking pins located thereon and attached thereto, each J-shaped locking pin of said at least two J-shaped locking pins having a stem portion devoid of aligning apparatus and a hooking portion formed thereon, said stem portion of said each J-shaped locking pin attached to said circuit board and exhibiting a substantially constant lateral cross-section there throughout, said hooking portion of said each J-shaped locking pin configured as a J-shaped portion defined by a radius of curvature, said J-shaped portion of said each J-shaped locking pin aligned with a J-shaped portion of an adjacent J-shaped locking pin, said J-shaped portion of said each J-shaped locking pin having a thickness;
• an integrated circuit-carrying structure having a first edge for supporting said substantially vertically oriented semiconductor package in a substantially vertical orientation on said circuit board and having a connection edge;
• at least one semiconductor memory device mounted on a portion of said integrated circuit-carrying structure;
• a plurality of package leads, at least one lead of said plurality of package leads connected to said at least one semiconductor memory device, each lead of said plurality of package leads extending from said connection edge of said integrated circuit-carrying structure and having a portion resiliently biased against said surface of said circuit board, wherein said plurality of package leads extends along substantially a full length of said connection edge of said integrated circuit-carrying structure;
• and
• at least one J-shaped locking receptor on each side adjacent said connection edge of said integrated circuit-carrying structure of said substantially vertically oriented semiconductor package for receiving said each J-shaped locking pin attached to said circuit board, said integrated circuit-carrying structure having a thickness no wider than said thickness of said J-shaped portion of said each J-shaped locking pin connecting said integrated circuit-carrying structure to said circuit board;
• and
• a system bus coupled to said central processing unit, said input device, said output device, and said circuit board.