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US 6,648,654 B1Granted
Electrical connector
AssigneeMicron Technology, Inc.
InventorsSalman Akram, David R. Hembree, Warren M. Farnworth
Life of this patent
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AssigneeMicron Technology, Inc.
InventorsSalman Akram, David R. Hembree, Warren M. Farnworth
Estimating the term…
In a socket to test semiconductor die, a recessed socket contact that avoids pinching the die contacts is disclosed. The socket contacts allow for smaller socket holes and allow denser contact spacing. A variety of embodiments are presented that are suitable for use depending on the spacing between the conductors. For more closely spaced conductors, the body of the socket contact comprises a head, a spring coupled to the head, and a shaft coupled to the spring. No outer shell is needed for the spring, as the nonconductive sides of the socket hole serve that function. For conductors spaced furthur apart, the body of the socket contact comprises a metal shaft having an aperture. Compression causes the shaft to close around the slit, thereby decreasing the amount of lateral buckling. For even more densely spaced contacts, semiconductor fabrication techniques are used to construct a dense array of contacts.
An electrical connector used to temporarily directly connect an IC chip to a substrate, comprising:
Dependencies are inferred from the claim text.