Slotted substrate and method of making
AssigneeHewlett-Packard Development Company, L.P.
InventorsJeremy Donaldson, Martha A. Truninger, Jeffrey S. Obert
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Abstract
The described embodiments relate to a slotted substrate and methods of forming same. One exemplary method patterns a hardmask on a first substrate surface sufficient to expose a first area of the first surface and forms a slot portion in the substrate through less than an entirety of the first area of the first surface. The slot portion has a cross-sectional area at the first surface that is less than a cross-sectional area of the first area. After forming the slot portion, the method etches the substrate to remove material from within the first area to form a fluid-handling
Claims2
A print head die comprising:
- a substrate having first and second generally opposing surfaces;
- a slot extending into the substrate along a long axis;
- and,
- wherein the slot has a cross-section taken transverse the long axis that is defined, at least in part, by a through region positioned between two shallow regions, wherein the through region has a first portion that is generally perpendicular to the first surface and a second portion that is obtuse relative to the first portion, and wherein individual shallow regions comprise a first portion that is generally parallel to the first surface and second portion that is obtuse relative to first portion.
Dependencies are inferred from the claim text.