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US 6,648,216 B2Granted
Process and apparatus for flow soldering
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsAtsushi Yamaguchi, Masato Hirano, Yoshinori Sakai
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Abstract
A flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material. Molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and the board is thereafter cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.
Claims7
A flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material, which process comprises:
- supplying a melt of the solder material such that the solder material adheres to a predetermined portion of the board in a solder material supplying zone;
- conditioning the board in a conditioning zone at a temperature in a range from a melting point of the solder material to a heat resistant temperature of the electronic component so as to ensure that the solder material adhering to the board is in a completely molten condition;
- and then
- cooling the board by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.
1 more element
Dependencies are inferred from the claim text.