Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin

A method of making a pin standing resin substrate, which comprises:

• thermally treating a pin by heating at a temperature of 500° C. or higher so as to soften the pin, wherein the pin comprises a rod comprising one of pure copper and 194 alloy and an enlarged diameter portion made of the same material as the rod, the enlarged diameter portion having a larger diameter than the rod and being formed at one end of the rod;
• and
• soldering at least the enlarged diameter portion of the pin to a pin-pad so as to fix the pin with a resin substrate, wherein the resin substrate has a substantially plate-shaped main surface and comprises one of a resin and a composite material containing a resin, the pin-pad being exposed from the main surface.

A method of making a pin standing resin substrate, which comprises:

• reducing the Vickers hardness (Hv) of a pin to 135 or less, wherein the pin comprises a rod and an enlarged diameter portion made of the same material comprising one of pure copper and 194 alloy, the pin having been thermally treated by heating at a temperature of 500° C. or higher, and the enlarged diameter portion having a larger diameter than the rod and being formed at one end of the rod;
• and
• soldering at least the enlarged diameter portion of the pin to a pin-pad so as to fix the pin with a resin substrate, wherein the resin substrate has a substantially plate-shaped main surface and comprises one of a resin and a composite material containing a resin, the pin-pad being exposed from the main surface.

A method of making a pin standing resin substrate, which comprises:

• soldering a pin-pad with at least an enlarged diameter portion of a pin, so as to fix the pin to a resin substrate,
• wherein the resin substrate has a substantially plate-shaped main surface and comprises one of a resin and a composite material containing a resin, the pin-pad being exposed from the main surface, the pin having a Vickers hardness (Hv) of 135 or less, the pin having been thermally treated by heating at a temperature of 500° C. or higher, and the pin comprising a rod and an enlarged diameter portion made of the same material comprising one of pure copper and 194 alloy, the enlarged diameter portion having a larger diameter than the rod and being formed at one end of the rod.

A method of making a pin for use in a pin standing substrate having at least one pin as an input/output terminal standing thereon, which comprises:

• thermally treating the pin by heating at a temperature 500° C. or higher so as to soften the pin,
• wherein the pin comprises a rod comprising one of pure copper and 194 alloy and an enlarged diameter portion made of the same material as the rod, the enlarged diameter portion having a larger diameter than the rod and being formed at one end of the rod.