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US 6,647,620 B1Granted
Method of making center bond flip chip semiconductor carrier
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Alan G. Wood
Life of this patent
Estimating the term…
Abstract
A center bond flip chip device carrier and a method for making and using it are described. The method includes forming a seat with a cut out portion in at least one trace on a substrate and providing an elastomeric material over the substrate. The seat is sized and configured to receive a conductive connecting structure. The elastomeric material has a gap at the seat to allow electrical connection of the conductive connecting structure with a semiconductor die.
Claims33
A method for making a carrier for a semiconductor device, said method comprising:
- forming a seat with a cut out portion in at least one trace located on a substrate, said seat being sized and configured to receive a conductive connecting structure wherein said cut out portion including a side wall between a pair of open ends of said at least one trace;
- and
- providing an elastomeric material over said substrate and said at least one trace with a gap at said scat to allow electrical connection of the conductive connecting structure with a semiconductor die.
A method of making a semiconductor device comprising:
- assembling a carrier, said assembling comprising:
- forming a seat with a cut out portion in at least one trace located on a substrate, said seat being sized and configured to receive a conductive connecting structure wherein said cut out portion including a side wall between a pair of open ends of said at least one trace;
- and
- positioning an elastomeric material over said substrate and said at least one trace with a gap at said seat to allow electrical connection of the conductive connecting structure with a semiconductor die;
- and electrically connecting said carrier with the semiconductor die.
2 more elements
Dependencies are inferred from the claim text.