US 6,647,613 B2Granted

Method of making a magnetic write head and in-process head structures

AssigneeHewlett-Packard Development Company, L.P.

InventorsPatricia A. Beck, Paul W. Poorman, George M. Clifford, Jr., Richard H. Henze

Life of this patent

Estimating the term…

Loading patent…

Abstract

A batch fabrication technique is described that increases the manufacturing efficiency of servo write heads and also improves servo pattern definition for fine features, while reducing tape and head wear. Multiple heads are fabricated as a batch from one or more ferrite wafers. A nominally flat, large wafer surface and a contour suitable for uniform photoresist application an planar photolithography permit fine servo pattern definition with low linewidth variation. Non-magnetic material is photolithographically defined to produce gaps above a spacer. The non-magnetic material may be photoresist, semiconductor materials, glass, metal or the like. The material may even be removed later to leave air gaps. Additionally, a lower ferrite wafer may be mated to the upper ferrite wafer to complete a magnetic circuit around the gaps. A rounded leading edge on the head creates an air bearing to reduce ware of the tape and of the head. The leading edge is rounded to form an air bearing between the head surface and the tape. Rounding of the leading edge can be accomplished by a variety of methods including blending, grinding, and faceting.

Claims3

Dependent claims

A method for forming a magnetic write head, comprising:

forming a first wafer having a first planar surface on a repeating pattern of ferrite portions separated by a non-magnetic spacer and a second surface opposite the first surface;
forming a groove in the first wafer along the second surface of the first wafer, the groove positioned along each non-magnetic spacer such that the non-magnetic spacers are exposed from the second surface of the wafer;
forming a second ferrite wafer having a first surface and an opposing second surface;
forming a plurality of grooves in the second wafer along the first surface of the second wafer;
positioning the first and second wafers such that the second surface of the first wafer faces the first surface of the second wafer and the grooves in the first wafer are aligned with the grooves in the second wafer;
bonding the first wafer to the second wafer;
forming a layer of photoresist on the first surface of the first wafer;
removing the photoresist to expose the first surface of the first wafer except at desired locations of recording gaps over the non-magnetic spacers;
and
forming a layer of magnetic material on the exposed first surface of the first wafer to a depth not greater than a depth of the remaining photoresist.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/791,903Filed 22 Feb 2001 · division
Priority: 28 Oct 1997
Published: US 2001/0007170 A112 Jul 2001
Granted: 18 Nov 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification14 codes

G11B 5/187
Structure or manufacture of heads, e.g. inductive: structure or manufacture of the surface of the head in physical contact with, or immediately…
G11B 5/584
With provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing…: for…
G11B 15/62
Guiding record carrier: maintaining desired spacing between record carrier and head
G11B 5/1871
Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap…:…

Family

Application08/959,509Parent of this division · filed 28 Oct 1997
Application09/449,010Parent of this division · filed 24 Nov 1999
US 2001/0007170 A1Pre-grant publication · published 12 Jul 2001
US 6,229,669 B1Parent of this division
US 6,018,444 AParent of this division
US 6,647,613 B2This patent

From the US filing history. Foreign family members aren’t listed.