Semiconductor laser device and method of manufacturing the same
AssigneeSony Corporation
InventorsKoji Iwamoto, Hiroki Nagasaki
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AssigneeSony Corporation
InventorsKoji Iwamoto, Hiroki Nagasaki
Estimating the term…
There is provided a long-life and highly reliable air ridge type semiconductor laser device having a multi-layer structure including a first cladding layer of n-Al0.7GaInP, an active layer of AlGaAs, a second cladding layer of p-Al0.7GaInP and a contact (capping) layer of p-GaAs epitaxially grown in this sequential order on a substrate of n-GaAs, in which the contact layer and an upper portion of the second cladding layer is etched to be a ridge stripe, and the second cladding layer comprises an upper layer, which constitutes the ridge stripe together with the contact layer, and a lower layer having a thickness of 0.3 μm, which is positioned below the upper layer and extend outwardly from the both lower ends of the upper layer, and further, the semiconductor laser device includes a protection layer being an epitaxially grown n-GaAs layer having a film thickness of 0.15 μm provided on an upper surface of the lower layer of the second cladding layer and side planes of the ridge stripe other than an upper surface thereof.
An air ridge type semiconductor laser device comprising a structure including an active layer sandwiched between a first cladding layer and a second cladding layer each having a conductivity type different from each other, said second cladding layer comprising an upper layer which forms a ridge stripe and a lower layer positioned below the upper layer, which extends outwardly from both lower ends of the upper layer, and a protection layer provided on an upper surface of said lower layer of said second cladding layer and on side planes of said ridge stripe other than an upper surface thereof, wherein:
A method for manufacturing an air ridge type semiconductor laser device, comprising the steps of:
Dependencies are inferred from the claim text.