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US 6,647,035 B1Granted
Ruggedized microchannel-cooled laser diode array with self-aligned microlens
AssigneeThe Regents of the University of California
InventorsBarry L. Freitas, Jay A. Skidmore
Life of this patent
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Abstract
A microchannel-cooled, optically corrected, laser diode array is fabricated by mounting laser diode bars onto Si surfaces. This approach allows for the highest thermal impedance, in a ruggedized, low-cost assembly that includes passive microlens attachment without the need for lens frames. The microlensed laser diode array is usable in all solid-state laser systems that require efficient, directional, narrow bandwidth, high optical power density pump sources.
Claims18
A laser diode package, comprising:
- a first heatsink package, having:
- a manifold layer with a coolant inlet, a coolant outlet and a coolant outlet duct running from near an edge of said manifold layer to said coolant outlet;
- a glass insert layer fixedly connected to said manifold layer, wherein said glass insert layer includes a glass insert inlet through-hole aligned with said coolant inlet, a glass insert edge opening aligned in proximity to said edge of said manifold layer and a glass insert outlet through-hole aligned with said coolant outlet;
- a microchannel layer fixedly connected to said glass insert layer, wherein said microchannel layer includes a microchannel coolant inlet aligned with said glass insert inlet through-hole, wherein said microchannel layer further comprises a microchannel layer outlet aligned with said glass insert outlet through-hole, wherein said microchannel layer includes a microchannel layer duct running from said microchannel coolant inlet to near an edge of said microchannel layer in proximity o said glass insert edge opening, wherein said microchannel layer duct comprises a microchannel array;
- and
- a conductive coating adherent to an outer portion of said first heatsink package in proximity to said edge of said microchannel layer, an edge of said glass insert layer in proximity to said glass insert edge opening and said edge of said manifold layer, wherein said edge of said glass insert layer defines the operating side of said first heatsink package;
- said laser diode package further comprising:
- a glass seal comprising a glass seal coolant inlet through-hole and a glass seal coolant outlet through-hole, wherein a first side of said glass seal is fixedly connected to said microchannel layer of said first heat sink package, wherein an edge of said glass seal is retracted from the edge of said microchannel layer on said operating side about the length of a laser diode bar, wherein said glass seal coolant inlet and said glass seal coolant outlet are aligned with said microchannel coolant inlet and said microchannel coolant outlet respectively;
- a second heatsink package substantially identical to said first heatsink package, wherein a second side of said glass seal is fixedly connected to the manifold layer of said second heatsink package, wherein said glass seal coolant inlet and said glass seal coolant outlet are operatively aligned with the coolant inlet and coolant outlet respectively of said second heatsink package;
- and
- a laser diode bar operatively and fixedly placed between said microchannel array of said first heatsink package and said manifold layer of said second heatsink package, wherein said laser diode bar is operatively and electrically connected to said conductive coating.
8 more elements
A method for making a laser diode package, comprising:
- fabricating a first heatsink package, comprising:
- providing a manifold layer with a coolant inlet, a coolant outlet and a coolant outlet duct running from near an edge of said manifold to said coolant outlet;
- providing a glass insert layer including a glass insert inlet trough-hole aligned with said coolant inlet, a glass insert edge opening aligned in proximity to said edge of said manifold layer and a glass insert outlet;
- through-hole aligned with said coolant outlet,
- fixedly connecting said glass insert layer to said manifold layer;
- providing a microchannel layer fixedly connected to said glass insert layer, wherein said microchannel layer includes a microchannel coolant inlet aligned with said glass insert inlet through-hole, wherein said microchannel layer further comprises a microchannel layer outlet aligned with said glass insert outlet through-hole, wherein said microchannel layer includes a microchannel layer duct running from said microchannel coolant inlet to near an edge of said microchannel layer in proximity to said glass insert edge opening wherein said microchannel layer duct comprises a microchannel array;
- and
- providing a conductive coating adherent to an outer portion of said first heatsink package in proximity to (i) said edge of said microchannel layer, (ii) an edge of said glass insert layer in proximity to said glass insert edge opening and (iii) said edge of said manifold layer, wherein said edge of said glass insert layer defines the operating side of said heatsink package;
- said method further comprising:
- providing a glass seal comprising a glass seal coolant inlet through-hole and a glass seal coolant outlet through-hole, wherein a first side of said glass seal is fixedly connected to said microchannel layer of said first heat sink package, wherein an edge of said glass seal is retracted from the edge of said microchannel layer on said operating side about the the length of a laser diode bar, wherein said glass seal coolant inlet and said glass seal coolant outlet are aligned with said microchannel coolant inlet and said microchannel coolant outlet respectively;
- fabricating a second heatsink package substantially identical to said first heatsink package, wherein a second side of said glass seal is fixedly connected to the manifold layer of said second heatsink package, wherein said glass seal coolant inlet and said glass seal coolant outlet are operatively aligned with the coolant inlet and coolant outlet respectively of said second heatsink package;
- and
- providing a laser diode bar operatively and fixedly placed between said microchannel array of said first heatsink package and said manifold layer of said second heatsink package, wherein said laser diode bar is operatively and electrically connected to said conductive coating.
10 more elements
Dependencies are inferred from the claim text.