Non-volatile memory
AssigneeHewlett-Packard Development Company, L.P.
InventorsTerril N. Hurst, Craig Perlov, Carol Wilson, Carl Taussig
Life of this patent
Estimating the term…
Loading patent…
AssigneeHewlett-Packard Development Company, L.P.
InventorsTerril N. Hurst, Craig Perlov, Carol Wilson, Carl Taussig
Estimating the term…
A data storage device is disclosed that comprises a cross-point memory array formed on a dielectric substrate material. The cross-point memory array comprises first and second sets of transverse electrodes separated by a storage layer including at least one semiconductor layer. The storage layer forms a non-volatile memory element at each crossing point of electrodes from the first and second sets. Each memory element can be switched between low and high impedance states, representing respective binary data states, by application of a write signal in the form of a predetermined current density through the memory element. Each memory element includes a diode junction formed in the storage layer, at least whilst in the low impedance state. A plurality of the data storage devices can be stacked and laminated into a memory module providing inexpensive high capacity data storage. Such a memory module can be employed in an archival data storage system in which the memory module provides a write-once data storage unit receivable in an appliance or interface card.
A data storage device, comprising a cross-point memory array formed on a dielectric substrate material, the cross-point memory array comprising first and second sets of transverse electrodes separated by a storage layer including at least one semiconductor layer, the storage layer forming a non-volatile memory element at each crossing point of electrodes from the first and second sets, each memory element being switchable between low and high impedance states, representing respective binary data states, by application of a write signal in the form of a predetermined current density through the memory element, each memory element including a diode junction and a fuse or an anti-fuse formed in said storage layer.
A memory module comprising a plurality of memory circuits formed in a unitary package, each memory circuit comprising a non-volatile cross-point memory array and an address decoding circuit fabricated on a common non-semiconductor substrate, wherein each memory circuit is formed from first and second layers of traverse conductor tracks separated by a storage layer including at least one non-semiconductor substrate layer.
A memory module as claimed in claim 24, wherein each memory element is switchable between low and high impedance states, representing respective binary data states, by application of a write signal in the form of a predetermined current density through the memory element, each memory element including a diode junction and a fuse or an anti-fuse formed in said storage layer.
A digital data memory system comprising:
Dependencies are inferred from the claim text.