Low inductance multiple resistor EC capacitor pad
AssigneeInternational Business Machines Corporation
InventorsManfred Cwik, Harald Pross, Rene Frank Schrottenholzer
Life of this patent
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Abstract
According to the present invention a pad arrangement is provided for applying reworks or engineering changes to an electronic circuits to be formed on the circuit board, the pad arrangement comprising a first signal pad for being electrically connected to a first signal line, a second signal pad for being electrically connected to a second signal line, a ground pad being connected to a ground line provided on the circuit board, and a voltage pad being connected to a supply voltage line provided on the circuit board, whereby the pads are arranged in proximity to each other for facilitating a placement of electronic devices between at least two of the pads.
Claims8
A pad arrangement (200) on a printed circuit board (300) having two face surfaces for applying reworks or engineering changes to an electronic circuits to be formed on said printed circuit board (300), the pad arrangement (200) comprising:
- a conducting path and pads on the surface of both faces of said printed circuit board (300) including,
- a first signal pad (202) for being electrically connected to a first signal line,
- a second signal pad (204) for being electrically connected to a second signal line,
- a ground pad (206) being connected to a ground line provided on said printed circuit board (300), and
- a voltage pad (208) being connected to a supply voltage line provided on said printed circuit board (300), whereby the pads (202, 204, 206, 208) are arranged in proximity to each other for facilitating a placement of electronic devices (414, 514, 515) between at least two of said pads (202, 204, 206, 208), and
- a third signal pad being electrically connected to said first signal pad (202),
- a fourth signal pad being electrically connected to said second signal pad (204),
- another ground pad being connected to a ground line provided on said printed circuit board, and
- another voltage pad being connected to a supply voltage line provided on said printed circuit board (300), whereby the pads are placed on the opposite surface of said printed circuit board (300) and are again arranged in proximity to each other for facilitating a placement of electronic devices (414, 514, 515) between at least two of said pads,
- and wherein a group of two signal pads (202, 204, 206, 208), a ground pad (206) and a voltage pad (208) are substantially arranged in the edges of a square and wherein in said group said ground pad (206) and said voltage pad (208) are arranged next to each other;
- and
- the connection between said ground pad (206) to said ground line and between said voltage pad (208) to said voltage line are formed basically on the edge of the respective pad which is closest to the respective other of said signal pads (202, 204, 206, 208).
Dependencies are inferred from the claim text.