Power connection structure
AssigneeCisco Technology, Inc.
InventorsDavid A. Popovich, Robert Ballenger
Life of this patent
Estimating the term…
Abstract
A multi-layer printed circuit board (PCB) has a plated through hole for receiving a pin of a component. The plated through hole passes through all layers of the PCB and includes a first conductive portion on a first surface of the PCB and a second conductive portion on a second surface of the PCB. At least one layer of the PCB includes a planar conductive material disposed over a planar insulating material. The conductive material surrounds the plated through hole and is separated therefrom by a gap.
Claims30
A multi-layer printed circuit board (PCB) comprising:
- a first layer;
- a second layer;
- at least one intermediate layer provided between the first layer and the second layer, the intermediate layer including a planner conductive material;
- and
- a plated through hole for receiving a pin of a component, the plated through hole including:
- a hole passing through all layers of the PCB;
- and
- a plated layer provided on a wall of the hole, the plated layer including a first conductive portion on a first surface of the first layer and a second conductive portion on a second surface of the second layer,
- wherein the planar conductive material includes a gap surrounding the plated through hole and separating the remaining planar conductive material therefrom.
A method for connecting a pin of a component to a multi-layer printed circuit board (PCB), the PCB including a first layer, a second layer, and at least one intermediate layer provided between the first layer and the second layer, the intermediate layer including a planar conductive layer, the method comprising:
- disposing a plated through hole for receiving the pin of the component, said disposing including:
- providing a hole passing through all layers of the PCB and the planar conductive material;
- plating the hole to provide a plated layer thereon, said plated layer including a first conductive portion on the first surface and a second conductive portion on the second surface;
- and
- providing a gap in the planar conductive material such that a gap surrounds said plated through hole and separates the remaining planar conductive material therefrom.
A method for providing a power connection to a multi-layer printed circuit board (PCB), the PCB including a first layer, a second layer, at least one intermediate layer provided between the first layer and a second layer, and a plated through hole for receiving a pin of a component, the intermediate layer including a planar conductive material, the plated through hole passing through the all layers of the PCB, said method comprising:
- electrically connecting the first layer to the second layer through the plated through hole;
- isolating the planar conductive material on the intermediate layer from the plated through hole;
- and
- electrically connecting the first layer, the planar conductive material of the intermediate layer, and the second layer by at least one via disposed through the all layers of the PCB.
An apparatus for providing a power connection to a multi-layer printed circuit board (PCB), the PCB including a first layer, a second layer, at least one intermediate layer provided between the first layer and a second layer, a planar conductive material disposed on each layer, and a through hole for receiving a pin of a component, the through hole passing through the all layers of the PCB and the planar conductive material thereon, said apparatus comprising:
- first means for electrically connecting the first layer to the second layer through the plated through hole;
- means for isolating the planar conductive material on the intermediate layer from the plated through hole;
- and
- second means for electrically connecting the first layer, the planar conductive material of the intermediate layer, and the second layer.
Dependencies are inferred from the claim text.