Sandwich-structured intelligent power module
AssigneeTyco Electronics Logistics AG
InventorsMichael Frisch, Bernd Winkens
Life of this patent
Estimating the term…
Abstract
The power substrate is inserted in a housing (1) as base plate and together with the same forms a standardized power part from whose top side (11) there are projecting terminal pins (5) which are soldered by through-soldering to via holes of the board (4). The circuit board (4), in a strip portion (6) thereof that remains free, has contact pads (7) as control and power terminals by means of which the module can be soldered directly into the slot-like opening of a system circuit board (8).
Claims4
An intelligent power module having control and power terminals, in which a board is arranged in a second plane parallel to a power substrate being arranged in a first plane and having at least one power semiconductor component, the power substrate being inserted as a base plate into a housing of electrically insulating material so that the power substrate and the housing, forms a power part with a plurality of terminal pins facing the board and extending through the board via a plurality of holes, said holes being arranged proximate an edge portion of the board;
- said terminal pins being soldered by through soldering to said holes of the board, with at least a strip portion along one edge of the board being left free from the holes and control components;
- and said board, on a second edge, has contact pads as control and power terminals by means of which the module can be soldered directly into the slot-like opening of a system circuit board, wherein control components are arranged in a portion of the board that is located directly opposite the top surface of said at least one power semiconductor component.
An intelligent power module, comprising:
- a housing of electrically insulating material;
- a power substrate having at least one power semiconductor component, the power substrate being positioned within said housing and, together with the housing forming a power part, said power substrate being arranged in a first plane;
- terminal pins projecting from a top side of said power part;
- a board arranged in a second plane parallel to said power substrate with said terminal pins being soldered by through soldering to the holes of the board, with at least a strip portion along an outer side of the board being left free from the holes and control components;
- and
- contact pads provided on the outer side of the board, as control and power terminals, profiled such that the module can be soldered directly into slot-like opening of a system circuit board;
- wherein the control components are arranged in a portion of the board that is located directly opposite the top surface of said at least one power semiconductor substrate.
Dependencies are inferred from the claim text.