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US 6,646,781 B2Granted
Loss prevention structures for optical modulation applications
AssigneeCodeon Corporation
InventorGanesh K. Gopalakrishnan
Life of this patent
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Abstract
An optical device includes a grounded base and an optical modulator chip having a top surface, a back surface and side surfaces. The optical modulator chip includes a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip. A resistive paint is on the back surface of the optical modulator chip to reduce losses due to extraneous modes or bias instabilities.
Claims19
An optical device, comprising:
- an optical modulator chip having a top surface, a back surface and side surfaces;
- at least one ground electrode and a signal electrode located over the top surface of the optical modulator chip;
- and
- a resistive layer applied on the back surface of the optical modulator chip, wherein the resistive layer has resistance such that electrical charge is dissipated on the back surface of the optical modulator chip and to prevent the optical modulator chip from coupling into parallel plate modes.
1 more element
An optical device, comprising:
- a grounded base having top surface;
- an optical modular chip having a top surface, a back surface and side surfaces, wherein the optical modulator chip is positioned over the grounded base with the back surface of the optical modulator chip facing the top surface of the grounded base;
- and
- a resistive layer positioned between the grounded base and the optical modulator chip, wherein the resistive layer has resistance such that electrical charge is dissipate on the back surface of the optical modulator chip and to prevent the optical modulator chip from coupling into parallel plate modes.
1 more element
An optical device, comprising:
- a grounded base having a top surface;
- an optical modulator chip having a top surface, a back surface and side surfaces, wherein the optical modulator chip is positioned over the grounded base with the back surface of the optical modulator chip facing the top surface of the grounded base;
- and
- at least one ground electrode and a signal electrode located over the top surface of the optical modulator chip, wherein a resistive layer is positioned between the top surface of the grounded base and the back surface of the optical modulator chip, wherein the resistive layer has resistance such that electrical charge is dissipated on the back surface of the optical modulator chip and to prevent the optical modulator chip from coupling into parallel plate modes.
1 more element
Dependencies are inferred from the claim text.