Electrooptic device, manufacturing method therefor with visual confirmation of compression bonding to terminals and electronic apparatus

A method of manufacturing an electro-optical device including:

• a transparent substrate and a counter substrate which are opposed to each other and comprise electrodes formed on opposite surfaces thereof;
• an overhang portion provided on the transparent substrate to extend outward relative to the counter substrate;
• connecting terminals formed on the overhang portion to be electrically connected to the electrodes;
• and
• a connection portion of an external circuit electrically connected to the connecting terminals through an anisotropic conductive film;
• the method comprising:
• the step of heating the anisotropic conductive film and compression-bonding the connecting terminals and the connection portion of the external circuit together to electrically connect the connecting terminals and the connection portion of the external circuit and the step of determining the connection state between the connecting terminals and the external circuit based on the presence of nicks or gouges formed by conductive particles contained in the anisotropic conductive film cutting into the connecting terminals which are visible through the transparent substrate.

An electro-optical device comprising:

• a substrate;
• connecting terminals disposed on a portion of said substrate;
• an external circuit;
• a plurality of conductive particles dispersed in an anisotropic conductive film connected between said external circuit and said connecting terminals;
• and nicks in said connecting terminals formed by said conductive particles which are visible through the transparent substrate.

A liquid crystal display device comprising:

• a first substrate having at least a portion which is transparent;
• a second substrate opposite the first substrate;
• a liquid crystal enclosed between the first and second substrates;
• a terminal formed on the first substrate;
• an external circuit on which a wiring pattern is formed, the external circuit being bonded to the terminal;
• a conductive particle connecting the terminal to the wiring pattern;
• and
• a nick portion formed on the terminal from contact with said conductive particle, the nick portion being thinner than another portion of the terminal such that the nick portion is observable through the first substrate.

A liquid crystal display device comprising:

• a first substrate having at least a portion which is transparent;
• a second substrate opposite the first substrate;
• a liquid crystal enclosed between the first and second substrates;
• a terminal formed on the first substrate;
• an external circuit on which a wiring pattern is formed, the external circuit being bonded to the terminal;
• and a conductive particle connecting the terminal to the wiring pattern, wherein the terminal includes a first portion and a second portion, the first portion having a higher transparency than the second portion, and wherein the conductive particle is arranged on the first portion which is visible through the first substrate.

A liquid crystal display device comprising:

• a first substrate having at least a portion which is transparent;
• a second substrate opposite the first substrate;
• a liquid crystal enclosed between the first and second substrates;
• a terminal formed on the first substrate;
• an IC on which a bump is formed, the IC being bonded to the terminal;
• a conductive particle connecting the terminal to the bump;
• and
• a nick portion formed on the terminal from contact with said conductive particle, the nick portion being thinner than another portion of the terminal such that the nick portion is observable through the first substrate.

A liquid crystal display device comprising:

• a first substrate having at least a portion which is transparent;
• a second substrate opposite the first substrate;
• a liquid crystal enclosed between the first and second substrates;
• a terminal formed on the first substrate;
• an IC on which a bump is formed, the IC being bonded to the terminal;
• and a conductive particle connecting the terminal to the bump,
• wherein the terminal includes a first portion and a second portion, the first portion having a higher transparency than the second portion, and wherein the conductive particle is arranged on the first portion which is visible through the first substrate.

An electro-optical device comprising:

• a substrate;
• a terminal formed on the substrate;
• said terminal including a first portion and a second portion, the second portion being thicker than that of the first portion;
• an external circuit bonded to the terminal;
• and a conductive particle arranged on the first portion of the terminal for connecting the terminal to the external circuit, the first portion being visible and recognizable through the substrate.