Connection for conducting high frequency signal between a circuit and a discrete electric component
AssigneeHEI, Inc.
InventorGuanghua Huang
Life of this patent
Estimating the term…
Abstract
An apparatus for processing high frequency signals comprises a circuit board has a trace. An electrical circuit is fabricated on a die, which is mounted on the circuit board. The die has a top portion and a contact point is positioned on the top portion. The circuit is configured to process a signal having a frequency in the range of about 20 GHz and higher. A capacitor is mounted on the circuit board and has a top portion and bottom portion. The bottom portion opposes the trace. A wire extends between the contact point on the top portion of the die and the top portion of the capacitor. The wire has a length in the range of about 2 mils to about 12 mils.
Claims41
An apparatus for processing high frequency signals, the apparatus comprising:
- an electrical circuit, the electrical circuit having a top portion and a contact point positioned on the top portion;
- a discrete electrical component, the discrete electrical component having a top portion and a contact point positioned on the top portion;
- an intermediate signal path, the intermediate signal path extending between the contact point on the top portion of the electrical circuit and the contact point on the top portion of the discrete electrical component;
- and
- a substrate having a surface, the electrical circuit and the discrete electrical component being mounted on the surface of the substrate, the surface of the substrate being spaced from the top portion of the discrete electrical component and from the top portion of the electrical circuit, the discrete electrical component providing a signal path between the intermediate signal path and the substrate.
An apparatus for processing high frequency signals, the apparatus comprising:
- a circuit board, the circuit board including an electrical circuit and a discrete electrical component;
- and
- a wire extending between the electrical circuit and the discrete electrical component, the wire not having direct contact with the circuit board, and the wire and discrete electrical component forming a signal path between the electrical circuit and the circuit board.
An apparatus for processing high frequency signals, the apparatus comprising:
- a circuit board, the circuit board including an electrical circuit and a discrete electrical component, the electrical circuit being fabricated in a die the contact point being formed in a top portion of the die;
- and
- a wire extending between the electrical circuit and the discrete electrical component, the wire not having direct contact with the circuit board, the wire being attached to the contact point with a ball bond, and the thickness of the discrete electrical component being about the same as the combined thickness of the die and the ball bond.
A method of manufacturing electronics, the electronics being mounted on a circuit board having a surface, the method comprising:
- mounting an electrical circuit to the circuit board, the electrical circuit having a contact point elevated off the surface of the circuit board;
- mounting a discrete electrical component on the circuit board, the discrete electrical component having a contact point elevated off the surface of the circuit board;
- and
- positioning a conductive path between the contact of the electrical circuit and the discrete electrical component, the conductive path and the discrete electrical component forming a signal path between the electrical circuit and the circuit board.
A method of processing a high frequency electrical signal, the method comprising:
- conducting the electrical signal through an electrical circuit, the electric circuit being mounted on a circuit board, the electrical signal having a frequency in the range of about 20 GHz and higher with a reflection coefficient of about −15 dB or less;
- directly conducting the electrical signal from the electrical circuit to an intermediate signal path at a contact point physically isolated from the circuit board;
- and
- directly conducting the electrical signal from the intermediate signal path to a discrete electrical component at a contact point physically isolated from the circuit boards, and from the contact point physically isolated from the circuit board to the circuit board.
A method of processing a high frequency electrical signal, the method comprising:
- conducting the electrical signal through an electrical circuit, the electric circuit being mounted on a circuit board, the electrical signal having a frequency in the range of about 20 GHz and higher with a reflection coefficient of about −15 dB or less, wherein the circuit board includes a trace;
- directly conducting the electrical signal from the electrical circuit to an intermediate signal path at a contact point physically isolated from the circuit board, wherein the discrete electrical component is a capacitor mounted on the trace;
- and
- conducting the electrical signal from the intermediate signal path, through the capacitor, and to the trace.
An apparatus for processing high frequency signals, the apparatus comprising:
- an electrical circuit, the electrical circuit having a top portion and a contact point positioned on the top, portion the electrical circuit, the electrical circuit being fabricated in a die, and the contact point being formed in a top portion of the die;
- a discrete electrical component, the discrete electrical component having a top portion and a contact point positioned on the top portion;
- an intermediate signal path, the intermediate signal path extending between the contact point on the top portion of the electrical circuit and the contact point on the top portion of the discrete electrical component, the intermediate signal path being attached to the contact point with a ball bond, the thickness of the discrete electrical component being about the same as the combined thickness of the die and the ball bond;
- and
- a substrate having a surface, the electrical circuit and the discrete electrical component being mounted on the surface of the substrate, the surface of the substrate being spaced from the top portion of the discrete electrical component and from the top portion of the electrical circuit.
An apparatus for processing high frequency signals, the apparatus comprising:
- a circuit board having a trace;
- an electrical circuit fabricated on a die, the die being mounted on the circuit board and having a top portion and a contact point positioned on the top portion, the circuit being configured to process a signal having a frequency in the range of about 20 GHz and higher with a reflection coefficient of about −15 dB or less;
- a capacitor mounted on the circuit board, the capacitor having a top portion and bottom portion, the bottom portion opposing the trace;
- and
- a wire, the wire extending between the contact point on the top portion of the die and the top portion of the capacitor, the wire having a length in the range of about 2 mils to about 12 mils.
Dependencies are inferred from the claim text.