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US 6,646,518 B2Granted
Balun and semiconductor device including the balun
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorMinoru Tajima
Life of this patent
Estimating the term…
Abstract
A balun includes a first conductive layer disposed on a top surface of a substrate, a second conductive layer having a shorter length than the first conductive layer and disposed on the top surface of the substrate, the second conductive layer having first and second end portions, a substrate having a through hole electrically connected to the second end portion of the second conductive layer, and a third conductive layer disposed on a bottom surface of the substrate, the third conductive layer having a first end portion electrically connected to the second end portion of the second conductive layer via the through hole, and the third conductive layer being tapered from a maximum width at the second end portion thereof to a minimum width at the first end portion thereof.
Claims19
A balun comprising:
- a first conductive layer formed as a rectangular strip and disposed on a top surface of a substrate, said first conductive layer having first and second end portions;
- a second conductive layer formed as a rectangular strip and having a shorter length than said first conductive layer and disposed on the top surface of said substrate, said second conductive layer having first and second end portions, the first end portion of said second conductive layer serving as a balanced transmission line in cooperation with the first end portion of said first conductive layer;
- said substrate having a through hole electrically connected to the second end portion of said second conductive layer;
- and
- a third conductive layer disposed on a bottom surface of said substrate, said third conductive layer having a first end portion electrically connected to the second end portion of said second conductive layer via said through hole, and a second end portion that serves as an unbalanced transmission line in cooperation with the second end portion of said first conductive layer, and said third conductive layer being tapered from a maximum width at the second end portion thereof to a minimum width at the first end portion thereof.
2 more elements
A balun comprising:
- a first conductive layer disposed on a top surface of a substrate, said first conductive layer having first and second end portions, and said first conductive layer being tapered from a maximum width at the second end portion thereof to a minimum width at the first end portion thereof;
- a second conductive layer formed as a rectangular strip and having a shorter length than said first conductive layer and disposed on the top surface of said substrate, said second conductive layer having first and second end portions, the first end portion of said second conductive layer serving as a balanced transmission line in cooperation with the first end portion of said first conductive layer;
- said substrate having a through hole electrically connected to the second end portion of said second conductive layer;
- and
- a third conductive layer formed as a rectangular strip and disposed on a bottom surface of said substrate, said third conductive layer having a first end portion electrically connected to the second end portion of said second conductive layer via said through hole, and a second end portion that serves as an unbalanced transmission line in cooperation with the second portion of said first conductive layer.
2 more elements
A balun comprising:
- first and second substrates that are laminated;
- a first conductive layer disposed between said first and second substrates, said first conductive layer having first and second end portions;
- a second conductive layer having a shorter length than said first conductive layer and disposed between said first and second substrates, said second conductive layer having first and second end portions, the second end portion of said second conductive layer serving as a balanced transmission line in cooperation with the first end portion of said first conductive layer;
- said laminated first and second substrate having a through hole electrically connected to the second end portion of said second conductive layer;
- a third conductive layer disposed on a top surface of said laminated first and second substrates, said third conductive layer having a first end portion electrically connected to the second end portion of said second conductive layer via said through hole, and a second end portion that serves as an unbalanced triplate transmission line in cooperation with the second end portion of said first conductive layer, and said third conductive layer being tapered from a maximum width at the second end portion thereof to a minimum width at the first end portion thereof;
- and
- a fourth conductive layer disposed on a bottom surface of said laminated first and second substrates, said fourth conductive layer having a first end portion electrically connected to the second end portion of said second conductive layer via said through hole, and a second end portion that serves as the unbalanced triplate transmission line in cooperation with the second end portion of said first conductive layer and the second end portion of said third conductive layer, and said fourth conductive layer being tapered from a maximum width at the second end portion thereof to a minimum width at the first end portion thereof.
4 more elements
A semiconductor device comprising:
- an electronic circuit disposed on a top surface of a substrate, said circuit having a pair of balanced terminals;
- a balun formed on said substrate, for connecting said pair of balanced terminals to an unbalanced transmission line, said balun including a first conductive layer formed as a rectangular strip and disposed on the top surface of said substrate, said first conductive layer having a first end portion connected to a terminal of said pair of balanced output terminals of said electronic circuit, and a second end portion, a second conductive layer formed as a rectangular strip and having a shorter length than said first conductive layer and disposed on the top surface of said substrate, said second conductive layer having a first end portion connected to the other terminal of said pair of balanced output terminals of said electronic circuit, and a second end portion, said substrate having a through hole electrically connected to the second end portion of said second conductive layer, and a third conductive layer disposed on a bottom surface of said substrate, said third conductive layer having a first end portion electrically connected to the second end portion of said second conductive layer via said through hole, and a second end portion that serves as said unbalanced transmission line in cooperation with the second end portion of said first conductive layer, and said third conductive layer being tapered from a maximum width at the second end portion thereof to a minimum width at the first end portion thereof;
- and
- an electronic module mounted on said substrate, for transmitting or receiving a signal to or from said electronic circuit by way of said balun.
1 more element
Dependencies are inferred from the claim text.