Complex circuit board, nonreciprocal circuit device, resonator, filter, duplexer, communications device, circuit module, complex circuit board manufacturing method, and nonreciprocal circuit device manufacturing method

A method for manufacturing a complex circuit board comprising the steps of:

• providing a dielectric substrate;
• providing a magnetic substrate;
• providing electrode patterns respectively on top and bottom faces of a substrate of low dielectric constant having a lower dielectric constant than the dielectric substrate;
• providing a through hole running between the electrode pattern on the top face and the electrode pattern on the bottom face;
• and affixing said dielectric substrate to said magnetic substrate so as to clasp said substrate of low dielectric constant therebetween.

A method for manufacturing a nonreciprocal circuit device comprising the steps of:

• providing a dielectric substrate;
• providing a film of low dielectric constant, comprising a substance having a lower dielectric constant than the dielectric substrate, on said dielectric substrate;
• providing an electrode pattern comprising a resonator portion which is formed at the portion of said dielectric substrate where said film of low dielectric constant is provided, and a transmission line portion which is formed at other portions thereof;
• affixing a magnetic substrate to said dielectric substrate and to said electrode pattern;
• and providing a magnet for applying a dc magnetic field to said electrode pattern.

A method for manufacturing a nonreciprocal circuit device comprising the steps of:

• providing a dielectric substrate;
• providing a magnetic substrate;
• providing electrode patterns respectively on top and bottom faces of a substrate of low dielectric constant having a lower dielectric constant than the dielectric substrate, the electrode patterns forming a resonator portion and a transmission line portion;
• providing a through hole running between the electrode pattern on the top face and the electrode pattern on the bottom face;
• affixing said dielectric substrate to said magnetic substrate so as to clasp said substrate of low dielectric constant therebetween, and so that said magnetic substrate is adjacent to or spaced a predetermined distance from the resonator portion, and said dielectric substrate is adjacent to or spaced a predetermined distance from the transmission line portion;
• and providing a magnet applying a dc magnetic field to said electrode patterns.