A method for testing semiconductor devices disposed on a wafer, each of the semiconductor devices including a main circuit part, a test function part for testing the main circuit part, and a switching circuit part for switching a signal path either to the main circuit part or to the test function part upon receipt of an external signal from outside of the semiconductor devices, the method comprising the steps of:
- firstly sending a first test signal from outside of the semiconductor devices through the switching circuit part of a given semiconductor device to the test function part thereof, subjecting the test function part to a self-diagnostic and testing the main circuit part using the test function part, judging the semiconductor device to be faulty if either the self-diagnostic of the test function part or the test on the main circuit part by the test function part has produced an abnormal result;
- secondly supplying the main circuit part of the semiconductor device judged faulty in said first step with a second test signal from outside of the semiconductor devices through the switching circuit part, and judging the main circuit part judged faulty in said first step by testing the main circuit part using the second test signal;
- and
- thirdly judging the semiconductor device judged faulty in said first step to be normal if the main circuit part thereof was judged normal in said second step.