Apparatus for forming coaxial silicon interconnects
AssigneeMicron Technology, Inc.
InventorsSalman Akram, David R. Hembree, Alan G. Wood
Life of this patent
Estimating the term…
Abstract
An interconnect apparatus for testing bare semiconductor dice comprises raised contact members on a semiconductive substrate. The contact members are covered with an insulation layer and a conductive cap connected by a conductive trace to a testing circuit. The trace is covered with coaxial layers of a silicon-containing insulation and a metal for shielding the trace from “crosstalk” and other interference. An apparatus for simultaneous testing of multiple dies on a wafer has thermal expansion characteristics matching those of the semiconductor die or wafer and provides clean signals.
Claims20
An apparatus for testing a circuit of a semiconductor device having a plurality of bond pads, comprising:
- a substrate comprising one of a non-conductive material and a semiconductor material, said substrate having a surface including a first layer of insulation on a portion thereof, said substrate having portions thereof for engaging said bond pads of said semiconductor device;
- a plurality of raised contact members, each raised contact member positioned on said surface of said substrate for contacting at least a portion of at least a bond pad of said bond pads of said semiconductor device;
- a plurality of conductive traces, at least one conductive trace of said plurality of conductive traces connected to each raised contact member of said plurality of raised contact members;
- a second layer of insulation overlying a portion of each of said plurality of conductive traces;
- and
- a conductive layer overlying a portion of said second layer of insulation providing shielding to said at least one conductive trace of said plurality of conductive traces.
An apparatus for testing a circuit of a semiconductor device having a plurality of bond pads, comprising:
- a substrate comprising one of a non-conductive material and a semiconductor material, said substrate having an insulative surface on at least a portion thereof, said substrate to overlie at least a portion of said semiconductor device;
- a plurality of raised contact members positioned on said insulative surface on said at least a portion of said substrate for contacting a portion of each bond pad of said plurality of bond pads of said semiconductor device, each raised contact member of said plurality of raised contact members including a projecting apex and a stop surface located adjacent to said projecting apex;
- a plurality of conductive traces, at least one conductive trace of said plurality of conductive traces connected to at least one raised contact member of said plurality of raised contact members;
- a second insulative surface substantially overlying each conductive trace of said plurality of conductive traces;
- and
- a conductive layer overlying said second insulative surface and each conductive trace of said plurality of conductive traces, providing shielding to each said conductive trace.
A testing apparatus for a circuit of a semiconductor device having a plurality of bond pads, comprising:
- a substrate comprising one of a non-conductive material and a semiconductor material, said substrate having a layer of insulating material located on at least a portion of a surface thereof, said substrate to overlie a portion of said semiconductor device;
- a plurality of raised contact members positioned on said surface of said substrate, each raised contact member of said plurality for contacting at least a portion of at least one bond pad of said plurality of bond pads of said semiconductor device;
- a plurality of conductive traces, one conductive trace of said plurality of conductive traces connected to at least one raised contact member of said plurality of raised contact members;
- a second layer of insulating material overlying each conductive trace of said plurality of conductive traces;
- and
- a conductive layer overlying at least a portion said second layer of insulating material.
Dependencies are inferred from the claim text.