Conductive material for integrated circuit fabrication
AssigneeMicron Technology, Inc.
InventorYungjun Jeff Hu
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Abstract
A conductive composition of titanium boronitride (TiBxNy) is disclosed for use as a conductive material. The titanium boronitride is used as conductive material in the testing and fabrication of integrated circuits. For example, the titanium boronitride is used to construct contact pads such as inline pads, backend pads, sensors or probes. Advantages of embodiments of the titanium boronitride include reduced scratching, increased hardness, finer granularity, thermal stability, good adhesion, and low bulk resistivity. Exemplary methods of creating the titanium boronitride include a sputtering process and a plasma anneal process.
Claims21
A testing system comprising:
- test circuitry;
- a probe in communication with the test circuitry;
- and
- a test pad in communication with the probe, wherein at least a portion of the test pad comprises TiBxNy.
A testing system for testing a semiconductor device comprising:
- test circuitry;
- a probe in communication with the test circuitry;
- and
- a test pad in communication with a semiconductor device and in communication with the probe, wherein at least a portion of the test pad comprises TiBxNy, and wherein the TiBxNy conducts an electrical signal between the test circuitry and the semiconductor device.
A testing system for testing an integrated circuit comprising:
- test circuitry wherein the test circuitry is configured to perform tests during an integrated circuit fabrication process;
- a probe in communication with the test circuitry, wherein the probe conducts an electrical signal;
- and
- a test pad in communication with a semiconductor device, wherein at least a portion of the test pad comprises TiBxNy, and wherein TiBxNy conducts the electrical signal when in contact with the probe.
Dependencies are inferred from the claim text.