Apparatus for providing mechanical support to a column grid array package
AssigneeBAE Systems Information and Electronic Systems Integration Inc.
InventorsTimothy Whalen, Santos H. Nazario-Camacho, Daniel S. Sherick
Life of this patent
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Abstract
An apparatus for providing mechanical support to a column grid array package is disclosed. The column grid array package uses solder columns to provide electrical connections between a ceramic substrate and a printed circuit board. The ceramic substrate has two sides, with an integrated circuit chip mounted on one side and many input/output pads mounted on the other side. Solder columns are attached between the input/output pads and the printed circuit board. A corner post is located at each corner of the column grid array package to secure the position of the ceramic substrate in relation to the printed circuit board.
Claims13
A column grid array package comprising:
- a substrate having an integrated circuit chip mounted on a first side of said substrate and a plurality of input/output pads located on a second side of said substrate;
- a plurality of wire columns attached between said plurality of input/output pads and a printed circuit board;
- and
- a corner post located at a corner of said substrate to secure the position of said substrate in relation to said printed circuit board.
A column grid array package for mounting integrated circuit chips onto a printed circuit board, said column grid array package comprising:
- a substrate having two sides, wherein an integrated circuit chip is mounted on one of said two sides and a plurality of input/output pads are located on another one of said two sides;
- a plurality of wire columns attached between said plurality of input/output pads and said printed circuit board;
- and
- an L-shape metal corner post located at a corner of said substrate to fasten the position of said substrate in relation to said printed circuit board to prevent any movement between said substrate in relation to said printed circuit board in the presence of vibrations on said column grid array package.
Dependencies are inferred from the claim text.