Structure comprising beam leads bonded with electrically conductive adhesive

A structure comprising:

• a plurality of electrically conducting beam leads in an array on an electronic chip carrier of a TAB package used for electrically connecting between an active matrix liquid crystal display (AMLCD) and a printed circuit board;
• said beam leads being electrically and mechanically joined to the electrodes on an AMLCD glass plate by means of an electrically conducting adhesive;
• said electrically conducting adhesive being deposited either on the said electrode pads of the said glass plate or on the said conducting beam leads of a TAB package;
• and
• wherein the said electrically conducting adhesive comprises:
• a thermoplastic or thermoset polymer resin matrix,
• no-clean solder flux,
• a plurality of electrically conducting particles with an electrically conducting fusible coating with at least some of said particles being fused to other said particles through said electrically conductive fusible coating.