Adhesive composition and methods for use in packaging applications

A semiconductor package comprising:

• a singulated portion of a leadframe including a mounting paddle and a plurality of trimmed lead fingers;
• a die;
• and
• an instant setting adhesive composition attaching the die to the mounting paddle.

A semiconductor package comprising:

• one or more leads;
• a die including one or more die bond pads;
• one or more electrically conductive elements for electrically connecting the one or more die bond pads to a portion of the one or more leads;
• and
• an adhesive provided to affix the at least a portion of the one or more leads to the die with the one or more die bond pads being free of the adhesive, wherein the adhesive is formed from an instant setting adhesive composition comprising:
• a cyanoacrylate adhesive component comprising a monomer of the formula:
• wherein R is selected from the group of a C1-6 alkyl, a cycloalkyl, an alkenyl, an alkynyl, a cycloalkenyl, an alkaryl, an aralkyl, and an aryl group;
• and
• at least one optional additive selected from the group of a thermal stabilizer, a thickener, a plasticizer, a toughener, a conductive filler, a dielectric additive, a moisture stabilizer, a curing inhibitor, an adhesion promoter, a storage stabilizer, a colorant, and an organic solvent.

A semiconductor package comprising:

• one or more leads;
• a die including one or more die bond pads;
• one or more electrically conductive elements for electrically connecting the one or more die bond pads to the one or more leads;
• and
• an adhesive provided to affix the at least a portion of the one or more leads to the die with the one or more die bond pads being free of the adhesive, wherein the adhesive is formed from an instant setting adhesive composition which when applied to a surface retains a discrete pattern in which it is applied within a time period of 0.10 seconds to 120 seconds.

A semiconductor package comprising:

• a singulated portion of a leadframe including a mounting paddle and a plurality of trimmed lead fingers;
• a die;
• and
• an instant setting adhesive composition attaching the die to the mounting paddle, wherein the instant setting adhesive composition when applied to a surface retains a discrete pattern in which it is applied within a time period of 0.10 seconds to 120 seconds.