Semiconductor device

A semiconductor device comprising

• at least one LSI chip provided on an electrode pad face thereof with metallic bump pads, and
• a multi-layer interconnection substrate having an outermost layer formed of an organic portion, said substrate being provided with metallic electrode pads each located in a position corresponding to that of each of said bump pads of the LSI chip,
• each of said bump pads of said LSI chip being in pressure contact with each of the electrode pads of the interconnection substrate through an adhesive so that each of the bump electrodes is electrically connected to each of the electrode pads formed in the interconnection substrate,
• said adhesive having a thermal expansion coefficient ranging from 20 to 60 ppm when measured by TMA measurement, so that each of said bump pads and each of the electrodes pads formed on the multi-layer interconnection substrate is in electrical contact with each other within an elastic deformation range of each of said bump pads and electrode pads at a cooling lower limit temperature defined within a guaranteed temperature range of said semiconductor device,
• said organic portion having at a room temperature circumstance a storage elastic modulus ranging from 5 to 10 GPa when measured by DMA measurement.

A semiconductor device comprising

• at least one LSI chip provided on an electrode pad face thereof with metallic bump pads, and
• a multi-layer interconnection substrate having an outermost layer formed of an organic portion, said substrate being with metallic electrode pads each located in a position corresponding to that of each of said bump pads of the LSI chip,
• each of said bump pads of said LSI chip being in pressure contact with each of the electrode pads of the interconnection substrate through an adhesive so that each of the bump electrodes is electrically connected to each of the electrode pads formed in the interconnection substrate,
• said adhesive having a thermal expansion coefficient ranging from 20 to 60 ppm when measured by TMA measurement, so that each of said bump pads and each of the electrodes pads formed on the multi-layer interconnection substrate is in electrical contact with each other within an elastic deformation range of each of said bump pads and electrode pads at a cooling lower limit temperature defined within a guaranteed temperature range of said semiconductor device,
• said organic portion having a peak value of a loss coefficient, which peak value is equivalent to a glass transition temperature thereof, in a range of 100° C. to 250° C. when measured by the DMA measurement and having no peak value of said loss coefficient in another range of 0° C. to 100° C.

A semiconductor device comprising

• at least one LSI chip provided on an electrode pad face thereof with metallic bump pads, and
• a multi-layer interconnection substrate having an outermost layer formed of an organic portion, said substrate being provided with metallic electrode pads each located in a position corresponding to that of each of said bump pads of the LSI chip,
• each of said bump pads of said LSI chip being in pressure contact with each of the electrode pads of the interconnection substrate through an adhesive so that each of the bump electrodes is electrically connected to each of the electrode pads formed in the interconnection substrate,
• said adhesive having a thermal expansion coefficient ranging from 20 to 60 ppm when measured by TMA measurement, so that each of said bump pads and each of the electrodes pads formed on the multi-layer interconnection substrate is in electrical contact with each other within an elastic deformation range of each of said bump pads and electrode pads at a cooling lower limit temperature defined within a guaranteed temperature range of said semiconductor device,
• said organic portion having at a room temperature circumstance a storage elastic modulus ranging from 5 to 10 GPa when measured by DMA measurement,
• said organic portion further having a peak value of a loss coefficient, which peak value is equivalent to a glass transition temperature thereof, in a range of 100° C. to 250° C. when measured by the DMA measurement and having no peak value of said loss coefficient in another range of 0° C. to 100° C.