Silane containing polishing composition for CMP

A polishing slurry comprising at least one silane in solution and at least one abrasive wherein the silane has the following formula:

• Y—Si—(X1X2R)
• dimers, trimers and oligomers thereof, wherein X1, X2 and Y are each independently selected from, hydroxy, a hydrolyzable substituent and a non-hydrolyzable substituent and wherein R is a non-hydrolyzable substituent.

An aqueous chemical mechanical polishing slurry comprising at least one abrasive and at least one soluble silane compound in solution wherein the soluble silane compound is present in the solution in an amount ranging from about 0.02 to about 5.0 wt % and wherein the silane compound has the formula:

• Y—Si—(X1X2R)
• dimers, trimers and oligomers thereof, wherein one substituent selected from R, X1, X2 and Y is selected from hydroxy or a hydrolyzable moiety and wherein three substituents selected from R, X1, X2 and Y are non-hydrolyzable moieties and wherein at least one non-hydrolyzable substituent is selected from alkyl or functionalized alkyl moieties each having from 2 to 25 carbon atoms.