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AssigneeHitachi, Ltd.
InventorsKazutaka Okamoto, Yasuo Kondo, Teruyoshi Abe, Yasuhisa Aono, Junya Kaneda, Ryuichi Saito, Yoshihiko Koike
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Provided are a composite material excellent in plastic workability, a method of producing the composite material, a heat-radiating board of a semiconductor equipment, and a semiconductor equipment to which this heat-radiating board is applied. This composite material comprises a metal and an inorganic compound formed to have a dendritic shape or a bar shape. In particular, this composite material is a copper composite material, which comprises 10 to 55 vol. % cuprous oxide (Cu2O) and the balance of copper (Cu) and incidental impurities and has a coefficient of thermal expansion in a temperature range from a room temperature to 300° C. of from 5×10−6 to 17×10−6/° C. and a thermal conductivity of 100 to 380 W/m·k. This composite material can be produced by a process comprising the steps of melting, casting and working and is applied to a heat-radiating board of a semiconductor article.
A composite material comprising a metal and an inorganic compound, most of said compound being granular grains with a grain size of from 5 μm to not more than 50 μm and dendrites, 1 to 10% of the whole of said compound being fine granular grains with a grain diameter of not more than 1 μm.
A composite material comprising a metal and an inorganic compound, said material being provided with a coefficient of thermal expansion or thermal conductivity in a solidification direction larger than that in the direction vertical to the solidification direction.
A composite material comprising copper and 10 to 55 vol. % copper oxide, said material being provided with a coefficient of linear expansion in a temperature range from a room temperature to 300° C. of 5×10−6 to 17×10−6/° C., a thermal conductivity at room temperature of 100 to 380 W/m·k, and an anisotropy.
A composite material comprising copper and copper oxide, said copper oxide being provided with a shape of a bar oriented in one direction, said material having a coefficient of linear expansion in a temperature range from a room temperature to 300° C. of 5×10−6 to 17×10−6/° C., a thermal conductivity at room temperature of 100 to 380 W/m·k, and another thermal conductivity in the oriented direction higher than that in a direction making right angles to the oriented direction, and the difference between the two being 5 to 100 W/m·k.
Dependencies are inferred from the claim text.