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US 6,646,332 B2Granted
Semiconductor package device
OwnerTerence Quintin Collierinventor
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Abstract
Disclosed are semiconductor packages and methods incorporating the use of vias in layers of leaded and nonleaded multilayer packages. The vias provide fluid communication between layers such that bonding material flows among layers for the formation of a 3D bond. As disclosed, the layers may comprise leads, dice, bond pads, or other substantially planar semiconductor package surfaces.
Claims18
A multi-layer laminated semiconductor package comprising:
- a first layer;
- a second layer adjoining the first layer, the second layer having a plurality of perforating vias;
- and
- an attach material disposed in the vias and between the adjoining first and second layers for bonding the first and second layers of the laminated semiconductor package.
1 more element
A multi-layer laminated semiconductor package comprising:
- a first perforated layer having a plurality of vias and a surface;
- a second layer aligned with the first layer, the surface of the first layer adjoining and being coplanar with a surface of the second layer;
- and
- an attach material located between adjoining coplanar surfaces of the first and second layer and within the plurality of vias such that a bond is formed between the layers wherein the vias provide an additional bonding surface.
1 more element
Dependencies are inferred from the claim text.