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US 6,646,291 B2Granted
Advanced optical module which enables a surface mount configuration
AssigneeSumitomo Electric Industries, Ltd.
InventorToshio Takagi
Life of this patent
Estimating the term…
Abstract
The optical module 10 of the present invention comprises a semiconductor optical device 14, a package 12 containing the semiconductor device, and lead terminals 22. The package 12 comprises a bottom member 34 and a side member 36. The bottom member contains a device mounting surface S2, the side member mounting surface S3, and a lead terminal joining surface S1. The optical semiconductor device 14 is mounted on the device mounting surface S2 and lead terminals are joined to the lead terminal joining surface S1.
Claims17
An optical module comprising:
- an optical semiconductor device;
- a package accommodating the optical semiconductor device therein, said package including a bottom member and a side member;
- and
- at least a lead terminal,
- wherein said bottom member includes
- a device mounting surface for mounting said semiconductor device thereon,
- a side member mounting surface for surrounding the device mounting surface therearound,
- a lead forming surface for joining said at least a lead terminal thereto and for surrounding said side member mounting surface therearound,
- a package substrate having a first surface, a conductive wiring being formed thereon, and
- a wiring substrate having a first surface and a second surface, said first surface of said package substrate is provided with said wiring substrate thereon so that said first surface of said package substrate contacts said first surface of said wiring substrate, and
- wherein said first surface of said package substrate includes said lead forming surface and said second surface of said wiring substrate includes said device mounting surface.
8 more elements
An optical module, comprising:
- an optical semiconductor device;
- a package for securing the optical semiconductor device therein;
- and
- at least a lead terminal,
- wherein the package has a side member and a bottom member comprising a wiring substrate for mounting the semiconductor device thereon and a package substrate for mounting the side member and the wiring substrate thereon, the lead terminal being attached to the package substrate, and a conductive wiring being formed on the package substrate to connect the lead terminal to the wiring substrate.
2 more elements
A light emitting module, comprising:
- a semiconductor light-emitting device for emitting light;
- a peripheral circuit for driving the semiconductor light-emitting device;
- a lens for condensing light emitted from the semiconductor light-emitting device;
- a package for securing the semiconductor light-emitting device, the peripheral circuit and the lens;
- and
- at least a lead terminal,
- wherein the package has a side member and a bottom member comprising a wiring substrate for mounting the semiconductor light-emitting device, the peripheral circuit and the lens thereon and a package substrate for mounting the side member and the wiring substrate, the lead terminal being attached to the package substrate, and a conductive wiring being formed on the package substrate to connect the lead terminal to the wiring substrate.
4 more elements
Dependencies are inferred from the claim text.