Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
AssigneeNitto Denko Corporation
InventorsAkihisa Kuroyanagi, Hisataka Ito, Shinichirou Sudo, Hirofumi Oono
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Abstract
A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.
Claims10
A wafer with a resin layer comprising plural projected electrodes and a cured resin layer formed on a projected electrode-mounting side of the wafer, wherein the cured resin layer is formed by a tablet comprising an epoxy resin composition, said epoxy resin composition comprising an epoxy resin represented by the general formula (1):
- wherein each of R1 to R5, is a hydrogen atom and m is 0 or a positive number of 5 or less and a curing agent, wherein the amount of the tablet that is reduced by heating is less than 0.05% by weight, and wherein said wafer has substantially no bowing.
A semiconductor device comprising an insulating substrate, a semiconductor element mounted on one side of the insulating substrate, and a cured product of an epoxy resin composition, the semiconductor element being incorporated in and sealed by the cured product, wherein the cured product of an epoxy resin composition is formed by a tablet comprising an epoxy resin composition, said epoxy resin composition comprising an epoxy resin represented by the general formula (1):
- wherein each of R1 to R5, is a hydrogen atom and m is 0 or a positive number of 5 or less and a curing agent, wherein the amount of the tablet that is reduced by heating is less than 0.05% by weight, and wherein said semiconductor device has substantially no bowing.
A semiconductor device comprising an insulating substrate, a semiconductor element mounted on one side of the insulating substrate via plural connecting electrodes, and a cured resin layer sealing a void between the insulating substrate and the semiconductor element, wherein the cured resin layer is formed by a tablet comprising an epoxy resin composition, said epoxy resin composition comprising an epoxy resin represented by the general formula (1):
- wherein each of R1 to R5, is a hydrogen atom and m is 0 or a positive number of 5 or less and a curing agent, wherein the amount of the tablet that is reduced by heating is less than 0.05% by weight, and wherein said semiconductor device has substantially no bowing.
Dependencies are inferred from the claim text.