Resin composition containing crystalline polyimide

Abstract

A resin composition containing a mixture produced by blending a crystalline polyamide expressed e.g. by formula (1) (in the formula, R1 is a bivalent organic aromatic group or aliphatic group having a carbon number of 2 to 30, optionally having substituent and optionally containing non-reactive groups such as ether group and aromatic group in the main chain, and Ar1 is an aromatic residue having a carbon number of 6 to 45 and optionally having substituent) with a thermoplastic polyester. The resin composition has excellent mechanical characteristics such as high elastic modulus, flow properties and heat-resistance and is suitable as a material for an electronic part for surface mounting.

Dependencies are inferred from the claim text.