Method of operating a processing chamber having multiple stations
AssigneeIntel Corporation
InventorsAndrew Ott, Jennifer L. O'Loughlin
Life of this patent
Estimating the term…
Abstract
A method for operating a multi-station processing chamber is described. A wafer is loaded onto the first station then indexed to the second station prior to processing. The indexing causes the wafer to be well-seated on it spindle before being processed. This prevents an improperly seated wafer from being processed at the first station.
Claims25
A method for operating a processing chamber having multiple stations, comprising:
- loading a wafer onto a first station,
- indexing the wafer to a second station prior to processing the wafer at the first station,
- processing the wafer at the second station,
- indexing the wafer and processing the wafer at each of the other stations,
- indexing the wafer onto the first station,
- processing the wafer at the first station.
A method for operating a multi-station deposition chamber where wafers are loaded and unloaded into the chamber at a first station, comprising:
- loading a wafer into the first station, and
- indexing the wafer to a second station before deposition occurs at the first station.
A method for operating a deposition chamber having four deposition stations, comprising:
- loading a first wafer into a first station,
- first indexing the first wafer to a second station prior to deposition occurring on the wafer at the first station, and
- depositing material in a first deposition in the chamber.
A method for operating a processing chamber having multiple stations, comprising:
- loading and indexing wafers until all the stations have a wafer that has been indexed, prior to any deposition occurring;
- and
- depositing material on the wafer at all the stations.
Dependencies are inferred from the claim text.