Method of holding substrate and substrate holding system
AssigneeHitachi, Ltd.
InventorsNaoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
Life of this patent
Estimating the term…
Loading patent…
AssigneeHitachi, Ltd.
InventorsNaoyuki Tamura, Kazue Takahashi, Youichi Ito, Yoshifumi Ogawa, Hiroyuki Shichida, Tsunehiko Tsubone
Estimating the term…
A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.
A substrate processing method for processing a substrate by a vacuum processing apparatus comprising a vacuum processing chamber, a gas supplying device for supplying a gas or plasma processing, and a substrate table having an electrostatic attraction device for holding the substrate in said vacuum processing chamber, said substrate table comprising:
Dependencies are inferred from the claim text.