Key hole filling
AssigneeLSI Logic Corporation
InventorsBruce J. Whitefield, Ashwin Ramachandran
Life of this patent
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Abstract
A method of forming an electrically conductive via that abuts a key hole formed in filler material. A void is etched through the filler material in which the key hole is formed, thereby forming a link between the void and the key hole. A liner is formed within the void, where the liner is formed to a thickness that is at least about half a minimum cross sectional dimension of the key hole, so as to plug the link between the void and the key hole and thereby trap any contaminants within the key hole. Electrically conductive via material is deposited within the void to form the via.
Claims20
A method of forming an electrically conductive via that abuts a key hole formed in filler material, the method comprising the steps of:
- etching a void through the filler material in which the key hole is formed, thereby forming a link between the void and the key hole,
- forming a liner within the void, the liner formed to a thickness that is at least about half a minimum cross sectional dimension of the key hole, so as to plug the link between the void and the key hole and thereby trap any contaminants within the key hole, and
- depositing electrically conductive via material within the void to form the via,
- wherein at least one of the filler material and the liner is a non electrically conductive material.
A method of forming a first electrically conductive via adjacent a second electrically conductive via, where the first electrically conductive via and the second electrically conductive via each abut a common key hole formed in a non electrically conductive filler material, the method comprising the steps of:
- etching a first void and a second void through the non electrically conductive filler material in which the key hole is formed, thereby forming a first link between the first void and the key hole and a second link between the second void and the key hole,
- forming an electrically conductive liner within the first void and the second void, the liner formed to a thickness that is at least about half a minimum cross sectional dimension of the key hole, so as to plug the first link between the first void and the key hole and the second link between the second void and the key hole, and thereby trap any contaminants within the key hole, the liner formed in a manner such that liner material entering the key hole from the first void does not contact liner material entering the key hole from the second void, and
- depositing electrically conductive via material within the first void and the second void to respectively form the first via and the second via.
A method of forming a first electrically conductive via adjacent a second electrically conductive via, where the first electrically conductive via and the second electrically conductive via each abut a common key hole formed in a filler material, the method comprising the steps of:
- etching a first void and a second void through the filler material in which the key hole is formed, thereby forming a first link between the first void and the key hole and a second link between the second void and the key hole,
- forming a non electrically conductive liner within the first void and the second void, the liner formed to a thickness that is at least about half a minimum cross sectional dimension of the key hole, so as to plug the first link between the first void and the key hole and the second link between the second void and the key hole, and thereby trap any contaminants within the key hole,
- removing the liner from a bottom of the first void and a bottom of the second void, and
- depositing electrically conductive via material within the first void and the second void to respectively form the first via and the second via.
Dependencies are inferred from the claim text.